EndoShape is looking to raise $2.5 million in a new round of debt financing, according to a new SEC filing from the coil embolization and occlusion company.
The Boulder, Colo.-based device maker develops minimally invasive plugs and coils for occluding blood vessels, including its flagship Medusa MultiCoil, which has FDA 510(k) clearance. The device is indicated for arterial and venous embolization in the peripheral vasculature.
Endoshape has already raised $1.2 million with $1.3 million left before it closes the round. The company did not disclose the identities of the 11 investors involved in the round, but lists High Country Venture and Volcano Capital as investors on its website.
Last June, EndoShape sought $6.8 million funding in an equity funding round, shortly after a $900,000 round it closed in January.
The post EndoShape looks to raise $2.5m appeared first on MassDevice.
from MassDevice http://ift.tt/1LCFb7o
Cap comentari:
Publica un comentari a l'entrada